products-IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
products-IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
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IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
TOF-SIMS
 TOF.SIMS 5
 TOF.SIMS 300
 TOF.SIMS 300 R
 Customised
LEIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS

The next generation metrology tool

The TOF.SIMS 300 R has an industrial design dedicated to
the demands of the semiconductor industry. Its recipes include trace metal detection with detection limits down to
108 atoms/cm2, detection of organic surface contaminants, high performance depth profiling, dosimetry of implants, and characterisation of sub-micrometer structures and defects.

The TOF.SIMS 300 R provides clean room compatible, automated 300 mm wafer handling, analysis and data reduction with high stability and performance.

With the 300 mm high-precision four-axes sample stage a new level of sample navigation has been reached. A linear travel speed of 20 mm/s and full wafer repeatability of less than 1 µm allow fast and accurate sample positioning on
the full 300 mm wafer.

The advanced design of the transfer system guarantees clean and fast 200 mm and 300 mm wafer handling. The layout with mini-environment, robot chamber with wafer storage and pre-aligner, and TOF-SIMS metrology module provides an optimum configuration for high sample throughput and excellent vacuum conditions.


IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS



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IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS High vacuum robot chamber with loadlock, wafer storage and pre-aligner.
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS Fully automated system operation and data evaluation.
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS FOUP loadport with class 1
mini-environment.
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS Optional loadlock system for the introduction of standards and small wafer pieces.
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS High performance TOF-SIMS metrology module.
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS
IONTOF-TOF-SIMS-TIME-OF-FLIGHT-SURFACE-ANALYSIS